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Endress+Hauser
Endress+Hauser Soliphant FTM50 Level Switch
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المعاملات الرئيسية
Measuring range
Vibronic point level for fine-grained/dusty/low bulk-density solids; compact FTM50 fork (no pipe extension family sibling FTM51)
Accuracy
No media calibration required; selectable density setting (high/low bulk density) and switching delay
Output
DC-PNP 3-wire; AC 2-wire; relay DPDT; 8/16 mA; NAMUR; PFM (electronic insert dependent)
Supply
Per electronic insert (AC 19…253 V; DC options; NAMUR/PFM per TI01570)
Process connection
Thread R 1½ / NPT 1¼–1½; EN/ASME/JIS flanges; Tri-Clamp hygienic options
Wetted parts
316L (polished options); PTFE coated; ETFE coated options
| المعامل | القيمة |
|---|---|
| Measuring range | Vibronic point level for fine-grained/dusty/low bulk-density solids; compact FTM50 fork (no pipe extension family sibling FTM51) |
| Accuracy | No media calibration required; selectable density setting (high/low bulk density) and switching delay |
| Output | DC-PNP 3-wire; AC 2-wire; relay DPDT; 8/16 mA; NAMUR; PFM (electronic insert dependent) |
| Supply | Per electronic insert (AC 19…253 V; DC options; NAMUR/PFM per TI01570) |
| Process connection | Thread R 1½ / NPT 1¼–1½; EN/ASME/JIS flanges; Tri-Clamp hygienic options |
| Wetted parts | 316L (polished options); PTFE coated; ETFE coated options |
| Housing | Aluminum / stainless / polyester housing codes per TI |
| Protection | F15/F16/F17: IP66/IP67 NEMA4X; F13/T13/F27: IP66/IP68 NEMA4X/6P |
| Media temperature | −50 to +280 °C (−58 to +536 °F) |
| Ambient temperature | −50 to +70 °C (−58 to +158 °F) |
| Display | Switch status LEDs (housing-/insert-dependent) |
| Communication | PFM / NAMUR switching to FTL325/FTL375 family switching units |
| Approvals | SIL 2 IEC 61508; ATEX/FM/CSA/IECEx; CE; RCM |
| Notes | Specs from E+H TI01570F/00/EN/03.21 (Soliphant M FTM50/51/52) and FTM50 product page. |
| Process Pressure | −1 to +25 bar (−14.5 to +362.5 psi) |
| Min Density | Density settings e.g. 200 g/l / 50 g/l short-fork high/low bulk density switches in TI |